The Unseen Victims of RTO Policies
In the rapidly evolving business landscape, the momentum toward policies mandating a return to the office (RTO) is gaining traction.
NIST Accomplishments: A Look Back at the Past Three Years
So much has changed since I walked onto the Gaithersburg, Maryland, campus of the National Institute of Standards and Technology (NIST) almost three years ago to begin my term as its director and U.S. Commerce Undersecretary for Standards and Technology.
TÜV SÜD Chosen for FCC IoT Labeling Program
(TÜV SÜD: Wakefield, MA) -- TÜV SÜD announced that it has been selected as one of 10 cybersecurity label administrators (CLAs) for the voluntary IoT cybersecurity labeling program of the U.S.
CIMdata Joins Webinar on Human Impacts of Generative AI on the Product Life Cycle
(CIMdata: Ann Arbor, MI) -- CIMdata, a global research, consulting, and education firm specializing in product life cycle management (PLM) and the digital transformation it enables, will participate in an upcoming webinar, “
Total Factor Productivity
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Photo by Zohair Mirza on Unsplash
Recent labor relations controversies and ongoing arguments about the minimum wage have raised questions as to how a supply chain should share the utility it produces.
Meeting the Challenge for Data Policies
Data are the fuel of the Information Age, and all organizations acknowledge the value of well-managed corporate data assets. The problems start when we begin to ask just exactly how the data assets are to be well managed.
Omnex Announces Latest Webinars for Lean and Automotive Standards
(Omnex: Ann Arbor, MI) -- Omnex has announced its latest webinars, “Lean Six Sigma—Introduction to the Tools and Methods,” “ASPICE PAM 4.0: What You Need to Know,” and “Performing TARA in Compliance with ISO/SAE 21434.”
Gauss Labs Releases AI-Based Virtual Metrology Solution, Panoptes VM 2.0
(Gauss Labs: Seoul, South Korea) -- Gauss Labs has released the second version of its AI-based virtual metrology solution, Panoptes VM 2.0.
Teams and the Magic Three
A recent Inc.com blog post by Jessica Stillman discusses Malcolm Gladwell’s ne
MIT Engineers Grow ‘High-Rise’ 3D Chips
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MIT engineers have developed a method to seamlessly stack electronic layers to create faster, denser, more powerful computer chips. The team deposits semiconducting particles (in pink) as triangles within confined squares, creating high-quality electronic elements directly atop other semiconducting layers (shown in layers of purple, blue, and green). Credit: Cube 3D Graphic
The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So chip manufacturers are looking to build up, rather than out.
