New 3D Chips Could Make Electronics Faster, More Energy-Efficient
Researchers have developed a new fabrication process that integrates high-performance gallium nitride transistors onto standard silicon CMOS chips in a way that’s low-cost and scalable.
The advanced semiconductor material gallium nitride (GaN) will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers.