(Tomocube: Daejeon, South Korea) -- Tomocube, a 3D nondestructive inspection and metrology company, has launched HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging.

HT-T1D is optimized for glass-substrate inspection and metrology workflows. When conventional in-line panel inspection tools, such as automated optical inspection (AOI) systems, flag a potential defect, HT-T1D takes the corresponding coordinates and reconstructs the interior of the glass substrate in three dimensions, resolving the location, morphology, and depth-wise characteristics of defects that surface inspection alone can’t reveal.

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