(Teledyne: Waterloo, ON) -- Teledyne DALSA announces the expansion of its AxCIS family of high-speed, high-resolution, fully integrated line scan imaging modules, now available in resolutions up to 1,800 dpi and lengths of up to 1,500 mm.

These easy-to-use contact image sensors (CIS) integrate sensors, lenses, and lighting in a single compact unit, offering a cost-effective inspection system for many demanding machine vision applications, including semiconductor wafer, battery, and print inspection.

Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers exceptional image quality with monochrome line rates of up to 80 kHz at a 14 µm pixel size, or resolutions up to 1,800 dpi. For color inspection, it outputs a native RGB 3-line rate of up to 60 kHz, at a 28 µm pixel size or 900 dpi resolution, so that flaws can be identified with unprecedented precision.

AxCIS also offers a unique high dynamic range (HDR) capability to further improve defect detectability. Its unique sensor design covers the entire field of view without missing pixels, providing a 100% seamless image without interpolation. The telecentric lens supports true metrology applications.

AxCIS has been designed for scalability across various fields of view using a single 24 V power supply. With a small form factor and an IP60 dust-proof optical path, AxCIS provides the flexibility to fit into systems with limited vertical clearance. Its SFP+ fiber-optic interface delivers high-throughput data over standard low-cost, long-length cables with immunity to EMI radiation for harsh industrial environments.

For more details, visit the Teledyne product page; for sales queries, visit the company’s contact page.

Teledyne DALSA’s expanded AxCIS contact image sensor family now offers resolutions up to 1,800 dpi and lengths up to 1,500 mm.