(Teledyne: Waterloo, ON) -- Teledyne DALSA, designer and manufacturer of digital imaging solutions, and provider of semiconductor products and services, will highlight its multispectral, aerospace, IR, and custom CCD and CMOS sensors and cameras at the SPIE Defense, Security and Sensing Conference. The conference runs April 23–27, 2012, in Baltimore, and Teledyne DALSA will be located at Booth No. 1719.

Teledyne DALSA will exhibit its camera solutions, ranging from low resolution to megapixel resolutions; the BOA smart camera, a highly integrated vision-inspection system for controlling quality and increasing productivity; the Genie cameras, which combine standard gigabit Ethernet technology with Teledyne DALSA’s trigger-to-image reliability framework to dependably capture and transfer images from the camera to the host PC; and extreme environment aerospace sensors.

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