(EV Group: Sankt Florian am Inn, Austria) -- EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, is actively engaged with customers and partners within the rapidly evolving co-packaged optics (CPO) ecosystem to support the needs of hyperscale data centers, AI infrastructure, and high-performance computing (HPC) applications.

Drawing on decades of expertise in advanced packaging, heterogeneous integration, and photonics manufacturing, EVG supports multiple stages of the CPO manufacturing value chain, from process development through high-volume manufacturing (HVM).

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