Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 µm are used to create tiny electrical connections between a semiconductor chip and other components.

The subject matter was incredibly complex, but the “ask” itself was simple.

(Yaskawa: Miamisburg, OH) -- Yaskawa America, Motoman Robotics Division (Yaskawa Motoman), a leading North American robotics manufacturer, has completed an expansion of its headquarters in Miamisburg, Ohio.

I once attended a presentation that Eli Goldratt gave for the Society of Manufacturing Engineers.

In the near future, significant and unpredictable external factors may combine to challenge the global business landscape in unprecedented ways. Responding effectively to those challenges will require adaptability.

(Robert Half: Menlo Park, CA) -- New research from talent solutions and business consulting firm Robert Half reveals a complex picture when it comes to worker productivity.

(Optical Gaging Products: Rochester, NY) -- Optical Gaging Products (OGP), a leading manufacturer of optical and precision metrology systems for industrial quality control, announces its all-new SG SmartCapture software, deliver

In 1988, a small company began developing and supplying electronic instruments that automatically compensate for temperature-induced errors in industrial gages that are used to make precision dimensional measurements.

The world keeps time with the ticks of atomic clocks, but a new type of clock under development—a nuclear clock—could revolutionize how we measure time and probe fundamental physics.

(SCANTECH: Hangzhou, China) -- The TrackScan Sharp series is a cutting-edge optical 3D scanning system powered by SCANTECH, engineered with 25-megapixel industrial cameras and advanced onboard proces