An upcoming symposium will offer attendees a unique environment to learn about the production of hazardous-substance-free (HSF) products. HSPM2006 International Leadership Symposium for Hazardous Substance Process Management will include a thorough overview of QC 080000 IECQ HSPM, a recently released standard that addresses new requirements in countries all over the world (such as RoHS in Europe and Articles 11 and 12 in China) prohibiting hazardous substances in exported electronic products and components. Industry leaders, executives of multinational companies and representatives from companies of all sizes are expected to attend to hear about the implementation of HSF requirements.

Dave Smith, chairman of the International Electrotechnical Commission Quality Assessment System for Electronic Components, will be the keynote speaker. Additional presenters will speak on such topics as, “Overcoming Resistance to Change on the Way to HSF,” “The Impact of HSF on Distribution,” and “Taking the Lead out of Solder.”

The symposium will be held June 5–9 at the San Francisco Airport Marriott in Burlingame, California. The Salot Bradley Group International is hosting the event.

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