An upcoming conference will offer attendees a unique environment to learn about the production of hazardous-substance–free (HSF) products. HSPM2006 will include a thorough overview of QC 080000 IECQ HSPM, a recently released standard that addresses new requirements (such as RoHS in Europe and Articles 11 and 12 in China) in countries all over the world. The standard prohibits hazardous substances in exported electronic products and components. Industry leaders, executives of multinational companies and representatives from companies of all sizes are expected to attend to hear about the implementation of HSF requirements.

Don Gray, chairman of the International Electrotechnical Commission Conformity Assessment Board, and Dave Smith, chairman of the International Electrotechnical Commission Quality Assessment System for Electronic Components, will be the keynote speakers. Additional presenters will speak on such topics as, “Overcoming Resistance to Change on the Way to HSF,” “The Impact of HSF on Distribution,” and “Taking the Lead out of Solder.”

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