(Molex: Lisle, IL) – Molex, a global electronics leader and connectivity innovator, has launched its Impress co-packaged copper solutions to meet the needs of next-generation data centers and AI workflows by delivering ultrahigh-speed data transmission and exceptional signal integrity.

Building on the proven on-substrate and near-ASIC expertise of Molex, Impress provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224 Gbps PAM-4 and beyond.

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