(Spar Point Group: Portland, ME) -- Three-dimensional modeling and 3-D laser scanning are exciting new technologies that are rapidly changing the way we plan and understand our environments.

(Apex: Cheshire, United Kingdom) -- The Large Volume Metrology Conference (LVMC) and Exhibition is the only European event solely dedicated to portable and large volume 3-D measurement technology.

(Computer Imprintable Label Systems: West Sussex, UK) -- Computer Imprintable Label Systems (CILS), a manufacturer of high-performance label identification systems, has developed a durable, full-color printed, synthetic label range to replace expensive riveted metal data plates.

(Paul Scherrer Institute: Villigen, Switzerland) -- A novel nano-tomography method developed by a team of researchers from the Technische Universität München (TUM), the Paul Scherrer Institute (PSI), and the ETH Zurich opens the door to computed tomography (CT) examinations of minute structures

(Creaform: Lévis, Quebec) -- Creaform, developer and manufacturer of the Handyscan 3D line of self-positioning handheld 3-D laser scanners, the optical CMM MetraSCAN 3D s

(CEESI: Boulder, CO) -- Ultrasonic meter users will have the opportunity to expand their knowledge at the 2011 Ultrasonic Meter Measurement Training Series, scheduled for Feb. 15–25 at the Rasa Sentosa Resort in Singapore. The annual event will include a workshop and two training courses.

(NIST: Gaithersburg, MD) -- Scientists at JILA and collaborators have demonstrated an improved laser-based “molecular fingerprinting” technique that picks out traces of key hydrogen-containing molecules and other molecules from a billion other particles in a gas in just 30 seconds or less—perfor

(Olympus: Hamburg, Germany) — Olympus has introduced advanced laser sharing and dual-port SIM scanning capabilities to its

(NIST: Gaithersburg, MD) -- The National Institute of Standards and Technology (NIST) has awarded a total of $50 million in grants to five institutions to support the construction of new scientific research facilities that will explore topics ranging from nanometer-scale electronics and “green”