(Manz Asia: Taoyuan, Taiwan) -- Manz Asia, a leading semiconductor advanced packaging equipment manufacturer, has announced a strategic partnership with Seiko Epson Corp. (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing.

The collaboration combines Manz Asia’s expertise in semiconductor equipment engineering, process integration, and intelligent software with Epson’s industry-leading inkjet printhead technology. By uniting these complementary capabilities, the companies are developing scalable lab-to-fab inkjet equipment to support next-generation semiconductor manufacturing.

The jointly developed inkjet equipment is available as a series of systems covering R&D, pilot production, and mass manufacturing, enabling semiconductor manufacturers to expand applications, validate materials efficiently, optimize process parameters, and scale seamlessly from development to high-volume production.

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