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U.S. 300 mm Chip Manufacturer Selects EAGLEi 300 FOUP Inspection Technology for Production

For precise pre- and post-clean carrier measurement evaluation

Wed, 09/06/2023 - 12:00
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(SHELLBACK Semiconductor Technology: Coopersburg, PA) -- SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, has sold its popular EAGLEi 300 FOUP inspection system to a major 300 mm chip manufacturer in the U.S.

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The sale, to an industry-leading global electronics manufacturer, highlights the increasing demand for EAGLEi’s advanced technology to ensure only carriers within tolerance enter production. EAGLEi 300 is used in prominent 300 mm fabrications worldwide and has established a benchmark for precise pre- and post-clean carrier measurement evaluation within the industry.

EAGLEi 300

 …

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