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Nordson DAGE

R&D and manufacturer of products for destructive and nondestructive mechanical testing and inspection of electronic components

Nordson DAGE

Dage was founded in 1961 and is a market leader in its chosen markets of semiconductor and PCBA manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and nondestructive mechanical testing and inspection of electronic components. It has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the United States, and maintains representative offices in other territories. With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGA, Chip Scale Packages (CSP) and other electronic components. More recently Nordson DAGE has been heavily involved in the testing of the newest technology 300 mm wafer bump shear. Dage was acquired by the Nordson Corp. in 2006. Visit www.nordson.com.

Mon, 08/30/2010 - 14:25
Product News: New X-ray Inspection System to Be Unveiled at SMTA ExhibitionNordson DAGE’s XD7600NT100HP offers oblique-angle viewing of up to 70°
Mon, 08/30/2010 - 14:25
(Nordson DAGE: Carlsbad, CA) -- Nordson DAGE has announced that its XD7600NT100HP X-ray inspection system will be exhibited at the SMTA International Electronics Exhibition and Conference scheduled on Oct. 26–27 in Orlando, Florida. The…
      

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