A team of university researchers, aided by scientists at the National Institute of Standards and Technology (NIST), have succeeded in integrating a new, highly efficient piezoelectric material into a silicon microelectromechanical system (MEMS).

Ask any metrologist, and you’ll likely get quite a diatribe about the challenge of making a good measurement of humidity.

In production plants across the globe, lean manufacturing techniques are being used to meet increasing demands placed on manufacturers.

Led by a group at the University of Maryland (UMd), a multi-institution team of researchers has combined modern materials research and an age-old metallurgy technique to produce an alloy that could be the basis for a new class of sensors and micromechanical device

It’s no secret that manufacturing processes have become more complex. Manufacturers have tried hard to infuse innovation into their products, usually as new features, technologies, or attributes.

The human eye is as comfortable with white light generated by diode lasers as with that produced by increasingly popular light-emitting diodes (LEDs), according to tests conceived at Sandia National Laboratories.

Whenever manufacturing nonconformances are discovered, immediate action is required to ensure that a flawed product is quickly identified, contained, and corrected at the suppliers’—and often the customers’—locations.

The Coordinate Metrology Society (CMS) announced today the results of their large-scale, interactive measurement study conducted at the 27th annual Coordinate Metrology Systems Conference (CMSC).

The international General Conference on Weights and Measures (CGPM) has approved a plan to redefine four of the seven base units of the International System of Units (SI) in terms of fixed values of natural cons

It was a dark and stormy evening as the graveyard shift started at Frankenstein’s Precision Parts. Tonight was the night: All of the parts for the Reanimation order were ready for inspection. The contracted inspector was due at midnight.