MIT Engineers Grow ‘High-Rise’ 3D Chips
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MIT engineers have developed a method to seamlessly stack electronic layers to create faster, denser, more powerful computer chips. The team deposits semiconducting particles (in pink) as triangles within confined squares, creating high-quality electronic elements directly atop other semiconducting layers (shown in layers of purple, blue, and green). Credit: Cube 3D Graphic
The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So chip manufacturers are looking to build up, rather than out.
