Olympus Micro-Imaging’s LEXT OLS3000-IR microscope was recently named the top quality assurance tool at the sixth annual Advanced Packaging Awards ceremony in San Francisco. The ceremony was part of SEMICON West 2006, a semiconductor industry trade show. The LEXT-IR offers near-infrared laser-scanning confocal technology and is designed for nondestructive interior observation of silicon wafers, integrated circuit chips, micro electro mechanical sensors and other semiconductor devices. Because it uses a laser for surface-profile measurements, it offers resolution much higher than conventional near-infrared imaging systems.

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