(imec: Leuven, Belgium) -- imec, a world-leading research and innovation hub in advanced semiconductor technologies, has announced the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today.

With this strategic milestone, imec reinforces its position as the industry’s launchpad into the angstrom era, giving its global partners’ ecosystem early access to the next generation of chip-scaling technologies. Integrated directly with a comprehensive suite of patterning and metrology tools and materials, the High NA EUV system empowers imec and its ecosystem partners to unlock the performance needed to pioneer sub-2 nm logic and high-density memory technologies that will fuel the rapid growth of advanced AI and high-performance computing.

Luc Van den hove, imec CEO, says, “The past two years have marked an important chapter for High NA EUV lithography, with imec and ASML joining forces with the ecosystem in its joint High NA EUV lithography lab in Veldhoven (Netherlands) to pioneer High NA EUV technology. With the installation of the EXE:5200 High NA EUV lithography system into our 300 mm cleanroom in Leuven, we aim to bring these High NA EUV patterning technologies to an industry-relevant scale and to develop the next-generation High NA EUV patterning use cases. As the industry moves into the angstrom era, High NA EUV will be a cornerstone capability, and imec is proud to lead the way by offering its partners the earliest and most comprehensive access to this technology.”

This milestone is a key element of imec’s five-year strategic partnership with ASML, supported by the EU (Chips Joint Undertaking and IPCEI), the Flemish government, and the Dutch government. Van den hove says, “As an integral part of the EU-funded NanoIC pilot line, the tool is set to play a pivotal role in strengthening Europe’s position as a leader in advanced semiconductor R&D in the decades to come.”

Having the ASML EXE:5200 High NA EUV lithography system in its cleanroom firmly positions imec as a comprehensive development environment for advanced patterning. The company’s deep ecosystem collaboration with leading chip manufacturers; equipment, material, and resist suppliers; mask companies; and metrology experts will allow it to ramp up learning cycles and enhance process stability to develop and demonstrate patterning for innovative logic and memory device technology.

Christophe Fouquet, CEO of ASML, says, “Imec’s installation of the EXE:5200 marks an important step into the angstrom era. Together, we’re accelerating High NA EUV extendibility for the next generations of advanced memory and compute.”

Imec anticipates the EXE:5200 High NA EUV lithography system to be fully qualified by Q4 2026. In the meantime, the joint ASML-imec High NA EUV lithography Lab in Veldhoven will remain operational, ensuring continuity in the High NA EUV R&D activities for imec and its ecosystem partners.

From left: Peter Vanoppen (ASML), Martin van den Brink (ASML), Luc Van den hove (imec), Matthias Diependaele (Flemish government), Patrick Vandenameele (imec).