(Nova: Rehovot, Israel) -- Nova has released its latest optical metrology solution, the Nova WMC. This modular platform has been specifically designed to address the complex requirements of the most advanced packaging applications in semiconductor manufacturing.

The Nova WMC represents a breakthrough in optical metrology, designed from the ground up as a completely new proprietary system. This platform stands out for its exceptional versatility, enabling it to seamlessly handle a wide range of wafer sizes and forms—including traditional and framed wafers—while supporting multiple metrology technologies in a modular manner. Thanks to this adaptability, WMC is well-positioned to meet the evolving needs of 2.5D and 3D advanced packaging processes, and uniquely equipped to deliver effective solutions for significant industry inflection points, such as hybrid bonding.

With its comprehensive capabilities, WMC empowers manufacturers to solve emerging challenges, cementing its potential as a cornerstone tool for next-generation packaging applications.

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