(Siemens Digital Industries Software: Plano, TX) -- Siemens Digital Industries Software has announced an innovative approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration, and accuracy of models for steady-state and transient thermal analysis to enhance design studies.

Introduced in the latest updates to Simcenter Flotherm software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the breakthrough Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with clients for use in downstream, high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.

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