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High-End C-Frame System for Thickness Measurement

Select between capacitive technology, confocal, triangulation sensors, or laser line triangulation

Micro-Epsilon
Tue, 12/14/2010 - 15:55
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(Micro-Epsilon: Passau, Germany) -- Micro-Epsilon has launched the MTS 8202, a modular thickness-control measurement system in C-frame construction. Equipped with calibration technology and supporting different physical measurement methods, the system offers a unique range of measurement solutions.

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Depending on requirements, users can select between capacitive technology, confocal, triangulation sensors, or laser line triangulation. The last option offers significant advantages, particularly for tilted and rippled test objects in the strip-metal industry. Micro-Epsilon’s correction-procedure system means that micrometer-precise thickness measurement is possible, even if the target is tilted.

The integrated calibration technology of the MTS 8202 will verify the system’s precision in less than a second, allowing easy monitoring of the test equipment for quality management purposes.

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