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DIS Makes 3-D Measurement Possible In Climatic Extremes

Real-time 3-D scanning from extreme heat to extreme cold

Dynamic Intelligent Solutions
Wed, 02/09/2011 - 12:02
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(Dynamic Intelligent Solutions: Clinton Township, MI) -- The ability to pinpoint a product’s dimensional profile before and after exposure to temperature and humidity extremes is a standard testing practice, but the ability to measure a component’s shape during exposure to harsh conditions is a new option.

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ChamberCam from Dynamic Intelligent Solutions (DIS) uses photogrammetry hardware and software to measure in real time what happens to a part during thermal cycling in an environmental chamber.

“Many times during testing under extreme climatic conditions, a part’s shape or dimensions will react in ways that engineers can’t detect, making it difficult to pinpoint what the root cause may be when a part fails or becomes dimensionally unstable,” says Jim Arnone, managing partner of DIS, a Clinton Township, Michigan, company.

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