(Teledyne: Waterloo, ON) -- Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, announced the release of its next-generation Linea HS2 8k back-side-illuminated (BSI) 1 MHz time delay integration (TDI) camera.

Designed for ultrahigh-speed imaging in light-starved conditions, the Linea HS2 8k camera joins the existing 16k models, delivering exceptional image quality with 5 µm resolution and an industry-leading maximum line rate of 1 MHz.

The Linea HS2 family features a highly sensitive multi-array charge-domain Teledyne DALSA CMOS BSI TDI sensor, available in 8k and 16k resolutions with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well capacity, depending on application requirements. This provides exceptional signal-to-noise performance and dynamic range for the most discriminating inspections.

This flexibility makes the Linea HS2 8k particularly well-suited for inspecting semiconductor wafers, high-density interconnects, genomics flow cells, or any other high-speed inspection applications. On-chip binning further enables higher web speeds to boost system throughput. The camera is equipped with Camera Link HS CX4 connectors for active optical cables, providing complete EMI immunity.

For more details, visit Teledyne’s product page. For sales questions, visit the contact page.

Teledyne DALSA’s Linea HS2 8k BSI