(Nanoverse Technologies: Beaverton, OR) -- Nanoverse Technologies (NVT) announces the release of a new advanced packaging line of tools.

NVT has recently developed the fastest, most advanced and versatile laser singulation and metrology tools in the industry. The advanced packaging product family includes 5500, 6600, 7700, and 9900, all based on a common platform architecture for fleet-wide tool matching.

The laser systems represent commercial deployment of a laser design exclusive to NVT. These are the only tools in the industry offering the integration of a true metrology solution and laser scribing/dicing capability, providing an industry first in true process control.

NVT CEO Jeff Albelo says, “We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and high-volume manufacturing alike. It’s a game changer.”

The flagship NVT 7700 represents a fusion of laser scribing with advanced metrology. The laser process delivers the highest die break strength laser process in the industry (2 to 3 times higher than current processes). Capable of processing up to 30 wafers per hour with < 3 µm placement accuracy, the system demonstrates a GR&R of less than 300 nm.

The Model 7700 includes multiple system modules designed for completely independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking of both mounted and unmounted wafers in mixed lot processing. The system software architecture enables flawless, recipe-driven automation with OHV compatibility. The laser scribing and dicing module employs a true ultrafast process capable of on-the-fly power adjustments. Completely SEMI compliant, the system supports both two and four load port configurations.

The NVT 6600 product family represents the same innovations targeting production environments, where integrated metrology isn’t required and a smaller tool footprint is desirable. The NVT 6600 retains the same coat, clean, bake, scribe, and dice capability as the flagship tool, at higher throughput.

The NVT 5500 is a stand-alone metrology and inspection system using a patented, phase-based, white-light approach. The result is a high-speed, high-resolution metrology system capable of whole-wafer scanning and delivering simultaneous 2D and 3D information without image stitching. As a dedicated metrology system, the NVT 5500 detects bumps, pads, debris, and defects on a wide array of substrates. The NVT technology can detect many films currently invisible to competitive systems, including nonconductive films (NCF).

Set for release in mid-2026, the NVT 9900 platform represents the next-generation evolution of laser-based singulation. The system includes a dual laser configuration to complete high-speed and high-quality, full-cut laser scribing and dicing as part of the die-prep process. The lasers can be different wavelength, pulse width, power, and pulse energy to customize the laser singulation options available to customers. Paired with or replacing plasma dicing, the NVT technology platforms represent an incredible advancement in back-end processing technology.

Visit www.nanovtech.com for further information or to chat about how NVT can enable your advanced packaging road map.

NVT 7700: Fully automated, recipe-driven, factory-ready