(EV Group: St. Florian, Austria) -- EV Group (EVG), a leading provider of innovative process solutions and expertise serving semiconductor designs and chip integration schemes, has introduced the LITHOSCALE XT maskless exposure (MLE) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications.

With a new dual-stage design, up to six exposure units, and a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a fivefold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is suited for applications involving multidie patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

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