(Ansys: Pittsburgh) -- Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric advanced packaging technologies. This team effort gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

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