To meet the precise requirements associated with semiconductor manufacturing, integrated circuit (IC) packaging and assembly providers must navigate complex quality certification processes, such as those for the well-known ISO 9001 and ISO 13485 standards. Another important certification for facilities handling delicate electronic parts and components is ANSI/ESD S20.20.

Electrostatic discharge (ESD) is one of the most common and costly threats to semiconductor manufacturing. For companies involved in semiconductor packaging and assembly, controlling ESD is not optional; it’s essential. Many companies choose to formalize their protection efforts by obtaining certification to ANSI/ESD S20.20, a globally recognized standard. Here’s why ESD certification matters, and what’s involved in the process. 

What is ESD, and why does it matter?

Characterized as the sudden flow of electricity between two objects with different electrical potentials, ESD is often caused by direct contact, an electrical short, or dielectric breakdown. In daily life, ESD typically creates a brief, harmless spark. In the semiconductor industry, however, ESD can cause damage to sensitive devices—either immediate or latent damage, which might not show up until the final product fails in the field.

Semiconductor components are especially vulnerable during packaging and assembly. During this stage, delicate die are handled, bonded, and interconnected to form finished chips or chip packages. Manual handling, equipment movement, and even packaging materials themselves can generate static charges capable of causing irreversible damage.  

Adherence to quality-focused certifications, such as ANSI/ESD S20.20, assures customers that all work performed in an electronics manufacturing facility adheres to the standard’s stringent requirements.

Packaging and assembly facilities pose heightened risks because:
• Multiple process steps involve physical contact with exposed devices.
• Materials such as plastics, tapes, and trays can create static electricity.
• Very fine structures—e.g., bump interconnects, through-silicon vias (TSVs), microbonded wires—are increasingly sensitive to voltage fluctuations.

Without rigorous ESD control, a single unintentional discharge can reduce yield, cause expensive rework, or introduce latent defects that might lead to failures in the field—all of which can damage customer relationships. In high-volume manufacturing, these problems can escalate quickly into major cost and reputation issues.

ANSI/ESD S20.20 basics

ANSI/ESD S20.20 is a standard developed by the EOS/ESD Association (ESDA) in partnership with the American National Standards Institute (ANSI). It outlines best practices for designing, implementing, and maintaining an ESD control program. Its goal is to help companies design, implement, maintain, and continuously improve a program to protect electronic parts, assemblies, and equipment susceptible to ESD damage. Certification is recognized globally and is often demanded by customers to verify that a supplier has effective ESD controls in place.

The standard provides a flexible framework that can be tailored to different environments, from wafer fabs to chip assembly facilities. It specifies how to identify ESD-sensitive items; how to control the work environment (e.g., grounding, ionization, humidity control); how to protect items through handling, packaging, and shipping; and requirements for employee training and ongoing program maintenance.

ANSI/ESD S20.20 applies to organizations that manufacture or handle electrical and electronic parts and equipment susceptible to damage by ESD ≥100V human body model and 200V charged device model. ESD can occur due to human contact with an electrical part, or to static created through the part’s interaction with other materials. The standard thus includes requirements for grounding, ESD-safe workstations, personnel training, and ESD control procedures to protect semiconductor components from ESD damage.

What does certification entail? 

Audits are performed by third-party certification bodies accredited by organizations like ANSI or ESDA, using experienced auditors who specialize in semiconductor environments. Audit length depends on facility size and complexity. A smaller packaging facility might need one to two days, while larger operations or those with multiple locations could take up to a week. Companies often prepare by conducting internal pre-audits to ensure they meet all requirements, which adds an extra day but is key to achieving compliance.

Auditors evaluate a number of factors, including:
• Documentation: Is there a written ESD control plan that aligns with S20.20 requirements?
• Facility controls: Is there ESD-safe flooring, grounded workstations, ionization equipment, and humidity control?
• Personnel grounding: Are wrist straps, heel straps, and garments properly used and tested?
• Equipment and materials: Are all tools, trays, packaging, and storage items ESD-safe?
• Training and compliance: Are employees trained on ESD risks and best practices?
• Monitoring and auditing: Are regular internal audits, equipment checks, and corrective actions part of the system?

Benefits of certification

Going through the certification process typically strengthens a company’s internal processes. It forces a comprehensive look at every point where static could be generated or transferred, and ensures those risks are addressed systematically. 

Facilities that pursue certification often see:
• Fewer product defects
• Higher yields
• Reduced rework and warranty costs
• Greater operational discipline

In semiconductor packaging and assembly, ESD poses a significant threat to sensitive electronic components, potentially compromising their quality and reliability. Having a formal ESD S20.20-certified facility with an ESD control program in place further assures customers of a packaging and assembly supplier’s role as a trusted partner, particularly when providing services to customers in high-stakes industries. In addition, new materials and techniques, such as fan-out wafer-level packaging, chiplet integration, or 3D stacking, can increase sensitivity to ESD, making this attention to detail even more critical.

Many semiconductor customers mandate ESD certification as a supplier qualification criterion. This is especially true in industries like automotive, aerospace, medical devices, and defense, where device reliability is critical. Certification demonstrates that a supplier can consistently deliver quality products protected from ESD risk, protecting the company’s reputation. In the semiconductor supply-chain ecosystem, a single ESD-related failure can ripple through multiple customers and end markets. Certification lowers that risk by ensuring that strong, verified protection measures are in place.

How to get there

ANSI/ESD S20.20 compliance reduces risks and improves the reliability of components. Device manufacturers demand ESD control measures to ensure component integrity, so compliance with ANSI/ESD S20.20 demonstrates a provider’s capability to protect sensitive components. Effective ESD controls also enable companies to reduce product failures and rework, ultimately lowering costs associated with ESD damage. 

The resistivity of all surfaces that come in contact with parts, components, and packages is measured, including furniture, table and floor mats, racks, shelves, carts, trays, and personal protective equipment (PPE) worn by packaging and assembly technicians, such as wrist straps, heel straps, and ESD shoes. To be classed as ESD-safe, a material’s surface resistance must not exceed 1x 10E11 Ω/square.

For tech companies, including packaging and assembly providers like QP Technologies, achieving compliance with this globally recognized industry standards is crucial for ensuring product quality, regulatory compliance, and customer satisfaction.

In January 2024, TÜV SÜD representatives performed an intensive audit of QP Technologies’ manufacturing facility in Escondido, California. The certifications team confirmed the ESD safety and compliance of QP Technologies’ IC packaging and microelectronic assembly line. The company’s quality engineers are trained to perform monthly monitoring and recordkeeping to maintain compliance, which is monitored and verified by the TÜV SÜD auditor. Because ESD S20.20 is a yearly certification, companies are audited annually to achieve a new certification before the prior one expires. 

ESD S20.20 certification opens doors to new business opportunities, helps mitigate risks, and ensures that companies can compete effectively, particularly in industries such as aerospace, defense, and medtech, for which these certifications represent a vital differentiator. By investing in ANSI/ESD S20.20 and other intensive certification processes, companies maintain a strong commitment to quality, establishing themselves as reliable, trusted partners in meeting customers’ rigorous quality requirements.