What’s the hottest thing in electronics and high-performance computing? In a word, it’s “cool.”

To be more precise, it’s a liquid cooling system developed at Georgia Tech for electronics and aimed at solving a long-standing problem: overheating.

Developed by Daniel Lorenzini, a 2019 Tech graduate who earned his Ph.D. in mechanical engineering, the cooling system uses microfluidic channels—tiny, intricate pathways for liquids—that are embedded within the chip packaging.

He worked with VentureLab, a Tech program in the Office of Commercialization, to spin his research into a startup company, EMCOOL, headquartered in Norcross, Georgia.

“Our solution directly addresses the heat at the source of the silicon chip and therefore makes it faster,” Lorenzini says. “Our design has our system sitting directly on the silicon chips that generate the most heat. Using the fluids in the micropin fins, it carries the heat that’s produced away from the chip.”

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