(Viscom: Hanover, Germany) -- In surface mount technology (SMT) electronic-assembly production, 3-D solder paste inspection (SPI) has established itself as the additional inspection gate to complement optical or X-ray inspection. The key task is detecting impermissible printed pads in terms of volume, form, smearing, and offset. In addition to providing defect detection, the Viscom 3-D SPI can accomplish much more.