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Elysium Inc.  |  10/10/2011

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Global Supply-Chain Challenges Addressed at Boeing/Northrop Grumman Interoperability Summit

Arizona summit registration deadline is Oct. 15, 2011

(Elysium: Southfield, MI) -- With almost 250 participants already registered for the third annual Boeing/Northrop Grumman Global Product Data Interoperability Summit, the list of speakers has now been released (see below). Industry-leading aerospace, automotive, software, and IT experts will address the data and communications challenges and opportunities that arise in today’s multi-CAD, multisupplier environment.

The summit is of interest to anyone working in the computer-aided design/manufacturing/engineering and product life-cycle management areas who would like to join in discussions about best practices in data management and exchange as they apply to this year’s theme of “Enabling a Globally Integrated Supply Chain.” Registration is open until Oct. 15, 2011, for those wishing to attend the Chandler, Arizona event, which takes place Nov. 7–10, 2011, at the Crowne Plaza San Marcos. For further information or to register, contact event coordinator Elysium at annalise.suzuki@elysiuminc.com.

In addition to co-hosts Boeing and Northrop Grumman, presenters and sponsors include Dassault Systèmes, Elysium, Honeywell, Intel, Kubotek, NIST, Siemens, and many others. Topics will include engineering collaboration, product data interoperability, quality and manufacturing, supplier transactions, and product life-cycle management from a datacentric viewpoint.

Boeing and Northrop will conduct closed sessions for the first day and a half; sessions open to registered attendees begin at 1 p.m. Nov. 8 and run through noon Nov. 10. The event agenda is available here.

Speakers and topics for open sessions of the 2011 Global Product Data Interoperability Summit:
• Russ Benson, Boeing, “Data Centric View of Product Life-Cycle Management”
• Danan Barnhart,Boeing, “Enabling Seamless and Secure Supplier Transactions”
• Richard Nelson, Boeing, “Business Analytics and Optimization”
• Thomas Cogswell, Boeing, “Building Business Value through Application Life-Cycle Management”
• Suzette Johnson, Ph.D., Northrop Grumman, “Delivering Value by Enabling Agility and Adapting to Change”
• Joseph Curley, Intel, “Technical Computing—a 24-month Forecast”

Open session presentations by sponsors (with moderated roundtable discussions in the areas of data exchange tools and processes, SOA, supplier and industry product life-cycle management, and visualization and spatial-integration technology):
• Charles Chen, Boeing, “CAD Model Quality and Translation Validation”
• L. Stephen Wolfe, Elysium, “A Cockpit for Engineering Data Distribution”
• Thomas Hedberg, Honeywell, “Engineering Collaboration in a CAD Neutral World”
• David McCoy, Boeing, “Global Supply Chains, Improving Adaptability and Information Flow”
• Simon Frechette, NIST, “Product Data Interoperability Issues in Product Lifecycle Support”
• James Ackron, CT Core Technologies, “Model Validation Using 3-D Evolution”
• Ian Boulton, PTC, “Interoperable Service Information—a Key Component of Global Product Life-Cycle Support”
• Craig Trudgeon, 3D PDF Consortium, “3-D PDF Update”
• Dinesh Khaladkar, eQ Technologic, “eQube-MI for Application(s) Migration and Real Time Integrations in Product Life-Cycle Management”
• Eugene Day, LMCO, “Configuration Manipulation via Type Version Control in a Teamcenter 8.3 Environment”
• Gregory Pollari, Rockwell Collins, “SAVI Behavior Model Integration Demonstration”
• Tony Anderson, Kubotek, “Using Automated Change Management Software to Improve Productivity and Reduce Costs”
• Phil Spreier, TechSoft 3D, “PDF Solutions for the Global Supply Chain”
• Joel Schoenberg, Microsoft, “Windows 8, with a Focus on Leveraging of Cloud-based Services”
• Tad Trias, NGC, “Efficient, High-Performance CAD Management over the Corporate WAN”
• Gregory Pollari and Steve Helton, Rockwell Collins and Boeing, “Estimating ROI for SAVI”
• Becky Smith, NGC, “License Management Discussion Forum”
• Richard Murrish, Boeing, “Cost Effect Visualization of Advanced Composite Structure”
• Max Fouache, IBM, “Long-Term Data Preservation to Support Aerospace and Defense Programs”
• Jon Jarrett, ATK, “Leveraging JT for Model-based Communication”
• Marko Weber and Carsten Fels, BCT Technology AG, “Automatic Data Validation and Quality Assurance in OEM and Supplier Collaboration and Processes”
• John O’Connor, VISTAGY, “Solving New Challenges in Composite Aerostructure Development”
• Adam J. Betcher and Jaime Ramirez, Boeing, “Workflow the Right Way”
• Scott Riggs, LMCO, “Implementing ITAR and IP Controls in a Collaborative Teamcenter 8.3 Environment”
• Greg Jensen, BYU, “Beyond the Single User SOA, PLM, CAD and CAE Paradigms – The Next Generation of Collaborative Engineering Tools”
• Lyle Fischer, Capvidia, “Exceeding D6-51991 Requirements – Helping Suppliers Get the Most Out of Their Manufacturing Process”
• Sreeram Bhaskara, DISCUS, “The Intelligent Technical Data Package and the Aerospace Production Part Approval Process”
• Tatyana Vidrevich, XSB Inc., “The Semantic Supply Web: Next Generation Component Part Research, Selection, and Management”
• Jeff Garner, Siemens, “Multi-CAD Strategies with NX Synchronous Modeling”
• Art Prangley, HP, “Hewlett Packard: Enabling the Technology Foundation Needed to Support Global Product Development”
• Narasimha Kanuparthy, Boeing, “Programmatic Access to ENOVIA (PATE)”
• Nigel Shaw, Eurostep Ltd., “Applying PLCS to Internal and External Collaboration through Life and Across Disciplines”
• John Tolbert and Crystal Haves, Boeing, “The Intellectual Property Lifecyle and Evolving Access Controls”
• Tony Provencal, ITI TranscenData, “V5 and NX: Identifying and Mitigating Migration Risks”
• Blake Courter, SpaceClaim, “Eliminating Waste with a Release-to-CAD Milestone”
• Bill Craig, Dassault Systèmes, “Better Decision Making through ‘Smart Data’ Access”
• Joe Krolla, Mentor Graphics, “Integrated Data Management in the PCB Design Process”
• Peter Schroer, Aras, “Implementing Open Source Product Life-Cycle Management”
• Chris Garcia, Anark, “The DOD’s Rapid Migration to Model-Based Enterprise”

Sponsors exhibiting at the 2011 Global Product Data Interoperability Summit:
• Elysium—Event coordinator
• 3D PDF Consortium
• AMD FirePro Professional Graphics
• Anark
• Aras
• BCT Technology
• Capvidia
• CT Core Technologies
• Dassault Systèmes
• Discus Software
• EQ
• Eurostep
• Flexera Software
• HP
• IBM
• ITI Transcendata
• Kubotek
• Mentor Graphics
• Microsoft
• MSC Software
• Part Solutions
• PTC
• Right Hemisphere
• Samtech
• Siemens
• SpaceClaim Corporation
• TechSoft 3D
• Theorem Solutions
• Vistagy
• XSB Inc.

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About The Author

Elysium Inc.’s picture

Elysium Inc.

Elysium specializes in the handling of 3-D geometry and develops interoperability solutions for digital design and product life-cycle management (PLM) markets. Elysium supports data exchange allowing companies to deploy best-in-class design and analysis tools, and maintain the highest data quality across their supply chain. Elysium products are the favored solutions of many leading companies for translating, repairing, and ensuring the product data quality of 3-D CAD/CAM, and CAE models. Elysium has an international network of partners and distributors; its regional headquarters are in Japan and Michigan.

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